Automatic grinding & polishing QATM
With the semi-automatic grinding and polishing machines both single and central pressure can be applied. The central pressure allows grinding and polishing of embedded, unembedded and oversized specimens. In combination with a removal measurement, grinding can be done automatically to a defined sample height if required. With single pressure, up to six samples (depending on sample holder) of different sizes can be processed in one sample holder by pressing on individual plungers.